Industrial Memory

DDR3 / DDR3L SO‑DIMM

JEDEC-standard DDR3 and DDR3L small-outline memory module for platforms using a 204‑pin SO‑DIMM architecture. Configurations are published at DDR3-1600 in 4 GB and 8 GB capacities.

1600 MHzMaximum Data Rate
8 GBMaximum Capacity
1.5 V / 1.35 VOperating Voltage
0–85 °COperating Temp. (TC)
SIMORCHIP industrial DDR3 SO-DIMM memory module
01

Technical Summary

Memory TechnologyDDR3 / DDR3L
Module TypeSO‑DIMM, unbuffered
Capacity4 GB / 8 GB
Data Rate1600 MHz
Operating Voltage1.5 V (DDR3) / 1.35 V (DDR3L)
Pin Count204‑pin
Bus Width64-bit, Non-ECC organization
Operating Temperature0 °C to 85 °C (TC)
02

Key Features

  • JEDEC-standard module design
  • Edge connector gold plating, 10 µin minimum
  • SPD programmed and verified in production
  • IQC, IPQC, FQC and OQC production quality control
  • RoHS / REACH / CE / FCC compliant
  • Limited Lifetime Warranty
03

Ordering Information

SIMORCHIP industrial ordering part numbers are listed below. Contact SIMORCHIP for configurations not listed.

Industrial Ordering Part Numbers

Ordering P/NCapacityData rateCLRankComponent compositionVoltageDatasheet
SMC04G8S3C164 GB1600 MHzCL111Rx8512M x 8, 8C1.5 VContact →
SMC04G8S3D164 GB1600 MHzCL111Rx8512M x 8, 8C1.35 VContact →
SMC08GFS3D168 GB1600 MHzCL112Rx8512M x 8, 16C1.35 VContact →

The C and D codes identify the 1.5 V DDR3 and 1.35 V DDR3L variants.

04

Electrical & Timing Specifications

Data Rate1600 MHz
CAS LatencyCL11
Operating Voltage1.5 V (DDR3) / 1.35 V (DDR3L)
SPD Supply Voltage3.0 V to 3.6 V
Bus Width64-bit, Non-ECC organization
Rank × organization1Rx8 (4 GB) · 2Rx8 (8 GB)
On-Die TerminationNominal and dynamic ODT for data strobe and mask signals
SPDOn-board SPD EEPROM with IC temperature sensor
ECC TypeNon-ECC module
05

Mechanical Specifications

Form FactorSO‑DIMM
Pin Count204‑pin
PCB Thickness40 ± 4 mil
PCB Construction8-layer
Edge ConnectorNickel underplating with a gold finish
Nickel Thickness100 µin minimum
Gold Thickness10 µin minimum
204‑pin SO‑DIMM
Outline drawn to scale. Dimensions in millimeters.
06

Environmental Specifications & Compliance

Operating Temperature0 °C to 85 °C (TC)
ComplianceRoHS · REACH · CE · FCC
StandardJEDEC
WarrantyLimited Lifetime Warranty

Operating temperature is specified as DRAM case temperature (TC).

07

Compatibility & Qualification

Check the DIMM socket, memory controller, board layout and firmware when selecting a module. Compatibility is verified on the target configuration according to the project requirements.

09

Production Verification

IQCIPQCFQCOQC

Production-level verification

  • Incoming, in-process, final and outgoing quality control
  • SPD programming and verification
  • Module functional verification before shipment

Project-level qualification

  • Target-platform compatibility verification
  • Stability verification under the defined operating conditions
  • Application-specific qualification where the program requires it

Production-level verification is part of the manufacturing flow. Project-level qualification is scoped per program.

12

Product Configuration Review

Provide the target platform architecture, required capacity, data rate, operating conditions and expected program lifecycle. SIMORCHIP engineering will review the applicable module configuration and qualification requirements.