Embedded Compute
In compact embedded systems, board layout, connector positions and enclosure space limit which modules will fit. Select memory and storage form factors before the board layout is finalized.
Platform Requirements
On compact embedded boards, the mechanical envelope determines which modules fit, and form factors should be set before the board layout is finalized.
Board Envelope
- Module length and height are constrained by the target enclosure and board layout
- Connector position and socket implementation determine applicable form factors
- Form-factor changes after board layout is finalized may require redesign and requalification
Design-In Timing
- Memory and storage form factors should be defined during platform integration
- Configuration changes after layout finalization may introduce additional redesign and qualification effort
- Initial samples should be evaluated before the platform configuration is formally frozen
Applicable Memory & Storage
Confirm each compact form factor against the module envelope and socket implementation on the target board.
Memory
- DDR3 / DDR4 / DDR5 SO‑DIMM
- Modules are qualified at JEDEC operating settings unless the program defines otherwise.
Storage
- mSATA
- M.2 PCIe 3.0 (2242)
Qualification Process
Mechanical clearance and socket compatibility are confirmed on the actual target board before the configuration is frozen.
Requirements Definition
Platform configuration, interfaces, operating conditions and lifecycle are identified.
Configuration Selection
Form factors are selected against the target board and program requirements.
Sample Verification
Initial samples are evaluated before configuration approval.
Platform Validation
Compatibility and stability are verified on the target platform.
Qualification
The configuration is approved against program requirements.
Production Control
Production runs under established quality-control procedures, with change review where included in the program scope.
Embedded Qualification Priorities
Embedded priorities begin at design-in, ahead of board layout finalization.
Platform Configuration Review
Provide the target board layout, available module envelope, memory architecture, storage interface, operating conditions and expected program lifecycle. SIMORCHIP engineering will review the applicable form factors and define the recommended qualification scope before design finalization.