Solutions · Embedded

Embedded Compute

Compact embedded platforms are constrained by board layout, connector position and available mechanical envelope. Memory and storage form factors must therefore be defined during the design-in stage before board layout is finalised.

01

Platform Requirements

Embedded-platform qualification is primarily determined by mechanical envelope, interface compatibility, board-layout constraints and design-in timing.

Board Envelope

  • Module length and height are constrained by the target enclosure and board layout
  • Connector position and socket implementation determine applicable form factors
  • Form-factor changes after board layout is finalised may require redesign and requalification

Design-In Timing

  • Memory and storage forms should be defined during platform integration
  • Configuration changes after layout finalisation may introduce additional redesign and qualification effort
  • Initial samples should be evaluated before the platform configuration is formally frozen
02

Applicable Memory & Storage

Applicable memory and storage forms are selected according to platform configuration and programme requirements. Final configuration is confirmed against the target board layout, interface requirements, operating conditions and programme lifecycle.

Memory

  • DDR3 / DDR4 / DDR5 SO-DIMM
  • Qualification is based on the approved operating configuration for the target platform; profile-based operation is evaluated only where explicitly defined within the project configuration

Storage

  • mSATA
  • M.2 PCIe 3.0 (2242)
03

Qualification Process

Qualification scope is defined according to platform configuration, operating conditions and programme requirements. The stages below describe a typical qualification sequence. Scope and sequence may vary according to project requirements.

01

Requirements Definition

Platform configuration, operating conditions, lifecycle requirements and applicable interfaces are identified.

02

Configuration Selection

Memory and storage forms are selected against the target board architecture and programme requirements.

03

Sample Verification

Initial samples are evaluated before configuration approval.

04

Platform Validation

Compatibility, stability and applicable performance characteristics are verified against the target platform.

05

Qualification

The applicable configuration is approved according to the defined programme requirements.

06

Production Control

Production proceeds under established quality-control procedures. Where configuration control is included in the approved programme scope, production follows the defined configuration and change-review requirements.

Post-Deployment Engineering Support

Failure analysis is applied to returned products or reported field issues where root-cause investigation is required. It is not a sequential stage of the qualification process above.

04

Embedded Qualification Priorities

Qualification priorities are defined per programme. On compact embedded platforms, the following areas are normally addressed.

Board Envelope
Confirmation of module dimensions, connector position and mechanical clearance.
Interface Compatibility
Verification of the SATA or PCIe interface and socket implementation against the target board.
Early Design-In
Definition of the memory and storage configuration before board layout finalisation.
Sample Verification
Evaluation on the actual target-board configuration before qualification.
Lifecycle Planning
Review of component continuity, generation transitions and change-control requirements against the expected programme lifecycle.

Platform Configuration Review

Provide the target board layout, available module envelope, memory architecture, storage interface, operating conditions and expected programme lifecycle. SIMORCHIP engineering will review the applicable form factors and define the recommended qualification scope before design finalisation.