Technology

Engineering Process & Verification

How SIMORCHIP controls quality, builds each product and verifies it on the target platform.

01

Standards & Specifications

Industrial memory configurations are specified against applicable JEDEC requirements. Product-specific electrical, timing, mechanical and environmental parameters are defined in each product datasheet.

Tiered racks of memory modules running under sustained test

Published Specifications

Applicable standards provide a defined reference for electrical, timing, mechanical and SPD-related requirements. Final product parameters are stated in each product datasheet.

Operating Configuration

Qualification references the operating configuration approved for the target platform, as supported by platform firmware and the memory controller.

Compatibility & Verification Reference

A defined industry specification provides a common technical reference when comparing module configurations. Compatibility depends on the target configuration, and requalification requirements depend on the scope of change.

Product-Specific Operating Conditions

Operating-temperature requirements are defined at product level. The applicable range should therefore be confirmed against the datasheet for the specific module or drive under evaluation.

02

Quality Control

Quality-control activities are applied across incoming material, in-process manufacturing, finished-product inspection and outgoing shipment verification.

Surface-mount placement line running a storage panel

IQC — Incoming Quality Control

Incoming materials are checked against procurement, configuration and acceptance requirements before they enter production.

IPQC — In-Process Quality Control

In-process checks are performed at defined manufacturing stages to identify process deviation before completion of the production lot.

FQC — Final Quality Control

Finished products are reviewed against applicable product specifications and defined inspection requirements prior to release for shipment preparation.

OQC — Outgoing Quality Control

Outgoing inspection verifies applicable shipment information, including product identification, quantity, labeling and packaging requirements before dispatch.

Automated Functional Testing

Automated test equipment is used where applicable to verify module or drive functionality against defined production requirements.

Inspection Stations

Final inspection reviews product identification, appearance and recorded test results before products are approved for packing.

03

Manufacturing Process

Manufacturing sequence varies according to product architecture and form factor. The following process routes summarize the principal control stages used for memory and storage production; individual steps apply where applicable to the approved production route for a given product.

01

Material Control

Incoming material checked and released to production

  • Incoming material
  • IQC inspection
  • Material confirmation
  • Warehouse control
02

SMT Assembly

Components mounted and soldered to the module

  • Component placement
  • SMT inspection
  • Soldering inspection
  • PCB depaneling
  • Visual inspection
03

SPD Programming & Functional Verification

Module descriptor programmed and module function verified

  • SPD programming
  • SPD verification
  • Module parameters verified against the part specification
04

Final Inspection & Product Identification

Finished module reviewed against its specification

  • Final inspection
  • Product identification and labeling
  • Appearance inspection
  • QC sampling
05

Packing & Release

Packed and released against the order

  • Packing
  • Packaging inspection
  • Carton packing and sealing
  • Finished goods warehouse

Routes above describe the principal control stages rather than a fixed step list. Product-specific operations, including enclosure assembly and thermal-component installation, apply only to the form factors that require them.

04

Testing & Verification

Verification is carried out at two levels. Production verification confirms manufacturing and functional requirements before product release. Platform qualification evaluates a configuration against a defined target system according to project requirements.

Inspector at a test station reviewing results for a batch of memory modules

Production Verification — DRAM

These checks are performed before product release, as specified in the approved production process.

SPD programmingSPD verificationModule parameters against the part specificationProduct identificationAppearance inspectionFinal inspection

Production Verification — Storage

These checks are performed before product release, as specified in the approved production process.

Declared capacity confirmedDrive function against production requirementsOperating behavior under the applicable test conditionsProduct information programmingFinal inspection

Platform Qualification

Compatibility is evaluated against the target platform configuration, including initialization behavior, operating point and the conditions defined for the project. Qualification scope is defined per project and is not performed on every shipped unit.

InitializationTrainingRecognitionOperating point

Performance & Stability Verification

Performance and stability verification is defined according to product type, target workload and project requirements. Temperature-related verification is performed according to the applicable product specification and defined test scope.

Test categories describe verification objectives. The applicable scope, conditions and acceptance criteria for a project are defined in the corresponding test documentation.

05

Technical Evaluation & Support

Provide the target platform, required product configuration, operating conditions and qualification requirements. SIMORCHIP engineering will review the applicable verification and technical-support scope.