Industrial Memory

DDR3 / DDR3L U‑DIMM

JEDEC-standard DDR3 and DDR3L unbuffered memory module for platforms using a 240‑pin U‑DIMM architecture. Configurations are published at DDR3-1600 in 4 GB and 8 GB capacities.

1600 MHzMaximum Data Rate
8 GBMaximum Capacity
1.5 V / 1.35 VOperating Voltage
0–85 °COperating Temp. (TC)
SIMORCHIP industrial DDR3 U-DIMM memory module
01

Technical Summary

Memory TechnologyDDR3 / DDR3L
Module TypeU‑DIMM, unbuffered
Capacity4 GB / 8 GB
Data Rate1600 MHz
Operating Voltage1.5 V (DDR3) / 1.35 V (DDR3L)
Pin Count240‑pin
Bus Width64-bit, Non-ECC organization
Operating Temperature0 °C to 85 °C (TC)
02

Key Features

  • JEDEC-standard module design
  • Edge connector gold plating, 10 µin minimum
  • SPD programmed and verified in production
  • IQC, IPQC, FQC and OQC production quality control
  • RoHS / REACH / CE / FCC compliant
  • Limited Lifetime Warranty
03

Ordering Information

SIMORCHIP industrial ordering part numbers are listed below. Contact SIMORCHIP for configurations not listed.

Industrial Ordering Part Numbers

Ordering P/NCapacityData rateCLRankComponent compositionVoltageDatasheet
SMC04G8U3C164 GB1600 MHzCL111Rx8512M x 8, 8C1.5 VOn Request →
SMC08GFU3C168 GB1600 MHzCL112Rx8512M x 8, 16C1.5 VOn Request →
SMC08GFU3D168 GB1600 MHzCL112Rx8512M x 8, 16C1.35 VOn Request →

Each ordering part number has its own datasheet, available on request. The C and D codes identify the 1.5 V DDR3 and 1.35 V DDR3L variants.

04

Electrical & Timing Specifications

Data Rate1600 MHz
CAS LatencyCL11
Operating Voltage1.5 V (DDR3) / 1.35 V (DDR3L)
SPD Supply Voltage3.0 V to 3.6 V
Bus Width64-bit, Non-ECC organization
Rank × organization1Rx8 (4 GB) · 2Rx8 (8 GB)
On-Die TerminationNominal and dynamic ODT for data strobe and mask signals
SPDOn-board SPD EEPROM with IC temperature sensor
ECC TypeNon-ECC module
05

Mechanical Specifications

Form FactorU‑DIMM
Pin Count240‑pin
PCB Thickness50 ± 4 mil
PCB Construction6-layer
Edge ConnectorNickel underplating with a gold finish
Nickel Thickness100 µin minimum
Gold Thickness10 µin minimum
240‑pin U‑DIMM
Outline drawn to scale. Dimensions in millimeters.
06

Environmental Specifications & Compliance

Operating Temperature0 °C to 85 °C (TC)
ComplianceRoHS · REACH · CE · FCC
StandardJEDEC
WarrantyLimited Lifetime Warranty

Operating temperature is specified as DRAM case temperature (TC).

09

Production Verification

IQCIPQCFQCOQC

Production-level verification

  • Incoming, in-process, final and outgoing quality control
  • SPD programming and verification
  • Module functional verification before shipment

Project-level qualification

  • Target-platform compatibility verification
  • Stability verification under the defined operating conditions
  • Application-specific qualification where the program requires it

Production-level verification is part of the manufacturing flow. Project-level qualification is scoped per program.

12

Product Configuration Review

Provide the target platform architecture, required capacity, data rate, operating conditions and expected program lifecycle. SIMORCHIP engineering will review the applicable module configuration and qualification requirements.