Industrial Storage

M.2 2242 PCIe Gen3 x4

M.2 2242 module on PCIe Gen3 x4 with NVMe protocol support. Available configurations include 128 GB–512 GB on PCIe Gen3 x4.

1800 MB/sSequential Read
1500 MB/sSequential Write
1,500,000 hoursMTBF
128 GB–512 GBCapacity
SIMORCHIP industrial M.2 2242 PCIe Gen3 x4 solid-state drive
01

Technical Summary

InterfacePCIe Gen3 x4
ProtocolNVMe 1.4
Form FactorM.2 2242
Capacity128 GB / 256 GB / 512 GB
Sequential Readup to 1800 MB/s
Sequential Writeup to 1500 MB/s
MTBF1,500,000 hours
Operating Temperature0 °C to 70 °C
02

Ordering Information

Part numbers are listed as published in the product datasheet. The datasheet is available on request during project review.

Industrial Ordering Part Numbers

Ordering P/NCapacityInterfaceDatasheet
SMC128GM24310128 GBPCIe Gen3 x4On request

Ordering part numbers for the remaining capacities are confirmed during the project review.

03

Performance & Endurance

The headline sequential read and write speeds represent the maximum values for this product family and vary by capacity. The table below lists capacity-specific values from the product datasheet.

CapacitySequential readSequential writeTBW
128 GB1800 MB/s1500 MB/s75 TB
04

Mechanical Specifications

Form FactorM.2 2242
Dimensions42 x 22 x 2.2 mm
42.0 mm 22.0 mm M.2 2242 PCIe Gen3 x4
Outline drawn to the dimensions stated in the product datasheet. Drive thickness and component height are not drawn.
05

Environmental Specifications

Operating Temperature0 °C to 70 °C
Storage Temperature-40 °C to 85 °C
Supply Voltage3.3 V

Temperature ranges are published as stated in the product datasheet. The measurement reference for the range is not specified in the approved source.

06

Compatibility & Qualification

Drive selection is determined by the available bay or socket, the host interface and the board layout. Compatibility verification is performed against the applicable target configuration according to project requirements.

08

Production Verification

IQCIPQCFQCOQC

Production-level verification

  • Incoming, in-process, final and outgoing quality control
  • Firmware version verification before shipment
  • Drive functional verification before shipment

Project-level qualification

  • Target-platform compatibility verification
  • Stability verification under the defined operating conditions
  • Application-specific qualification where the program requires it

Production-level verification applies to drives in manufacturing, where applicable to the approved production route for the product. Project-level qualification scope is defined according to project requirements and is not performed on every shipped unit.

09

Technical Documentation

The M.2 2242 PCIe Gen3 x4 specification document is available on request during project review. Refer to the product specification for the configurations listed under Ordering Information.

11

Product Configuration Review

Provide the target platform, the required capacity, the host interface, operating conditions and expected program lifecycle. SIMORCHIP engineering will review the applicable drive configuration and qualification requirements.