M.2 2280 PCIe Gen3 x4
M.2 2280 module on PCIe Gen3 x4 with NVMe protocol support. Available configurations include 128 GB–2 TB on PCIe Gen3 x4.
Technical Summary
Ordering Information
Part numbers are listed as published in the product datasheet. The datasheet is available on request during project review.
Industrial Ordering Part Numbers
| Ordering P/N | Capacity | Interface | Datasheet |
|---|---|---|---|
| SMC128GM28310 | 128 GB | PCIe Gen3 x4 | On request |
| SMC512GM28310 | 512 GB | PCIe Gen3 x4 | On request |
| SMC002TM28310 | 2 TB | PCIe Gen3 x4 | On request |
Ordering part numbers for the remaining capacities are confirmed during the project review.
Performance & Endurance
The headline sequential read and write speeds represent the maximum values for this product family and vary by capacity. The table below lists capacity-specific values from the product datasheet.
| Capacity | Sequential read | Sequential write | TBW |
|---|---|---|---|
| 128 GB | 1600 MB/s | 1000 MB/s | 75 TB |
| 256 GB | 2100 MB/s | 1600 MB/s | 150 TB |
| 512 GB | 2400 MB/s | 1650 MB/s | 300 TB |
| 1 TB | 2400 MB/s | 1650 MB/s | 600 TB |
| 2 TB | 2400 MB/s | 1650 MB/s | 1200 TB |
Mechanical Specifications
Environmental Specifications
Temperature ranges are published as stated in the product datasheet. The measurement reference for the range is not specified in the approved source.
Compatibility & Qualification
Drive selection is determined by the available bay or socket, the host interface and the board layout. Compatibility verification is performed against the applicable target configuration according to project requirements.
Industrial Program Controls
Configuration Control
Where configuration control is defined within the approved program scope, qualified configurations are managed through the applicable BOM and change-review requirements.
Read more →Platform Qualification
Compatibility and stability verification are performed against the applicable target platform according to the defined qualification scope.
Read more →Lifecycle Coordination
Component availability, controller or NAND transitions and requalification requirements are reviewed against program requirements.
Read more →Technical Change Management
Configuration changes are subject to technical review and requalification where required.
Read more →Production Verification
Production-level verification
- Incoming, in-process, final and outgoing quality control
- Firmware version verification before shipment
- Drive functional verification before shipment
Project-level qualification
- Target-platform compatibility verification
- Stability verification under the defined operating conditions
- Application-specific qualification where the program requires it
Production-level verification applies to drives in manufacturing, where applicable to the approved production route for the product. Project-level qualification scope is defined according to project requirements and is not performed on every shipped unit.
Technical Documentation
The M.2 2280 PCIe Gen3 x4 specification document is available on request during project review. Refer to the product specification for the configurations listed under Ordering Information.
Product Configuration Review
Provide the target platform, the required capacity, the host interface, operating conditions and expected program lifecycle. SIMORCHIP engineering will review the applicable drive configuration and qualification requirements.