Matte black aluminum. White diagonal geometry cutting across the surface like a precision mark. No color. No glow. No noise. The NX1 looks exactly like what it is — a tool built to perform.
No RGB. No performance theater. Just the work, done right.
[ SHADOW EDGE CLOSE-UP ] Heatspreader geometry detail White diagonal geometry · Matte black surface NX1 Front View ]
Why DDR4?
Still the most widely supported platform. Still the smart choice.
Bandwidth
25.6 GB/s
Enough throughput for gaming, 4K editing, and heavy multitasking without bottlenecking
Frequency
3600 MT/s
Intel XMP 2.0 Ready — Enable with one click in the BIOS on Intel platforms to unlock full rated speed. AMD DDR4 platforms will run at default JEDEC standard speeds.
Voltage
1.35V
Low-voltage design — less heat at source, more stable long-term operation
Compatibility
Universal
Fully compatible with both Intel and AMD DDR4 platforms
Capacity
32GB
Single module up to 32GB — run your entire workflow in memory, not in wait
* Data benchmarked against previous generation DDR3 products
The platform your system trusts. The speed it actually needs.
01 — Harder
Harder
288-pin · 3µm Hard Gold · Built to Last
3µm Hard Gold Plating · 288-pin Connector — Industry-leading plating thickness. 10,000+ insertion cycles without wear. Anti-oxidation, anti-corrosion, shorter signal path, stable contact every time.
▸ Visual: 288Pin + cross-section (3µm gold layer + nickel base)▸ Note: Standard consumer grade 0.5–1µm; 3µm is industrial-grade standard
Matte Black Aluminum Alloy Heatspreader — Full-coverage aluminum construction draws heat away from the chip efficiently. Keeps chip temperature stable so performance doesn't drift.
▸ Visual: heatspreader thermal conductivity cross-section
Simorchip Lifetime Warranty — Every NX1 ships with Simorchip's Limited Lifetime Warranty. We stand behind this hardware, indefinitely.
▸ Visual: Lifetime warranty badge — white border, Shadow Edge language
288
High-Density Pins
7×24
Day / Hours
∞
Lifetime Warranty
3µm
Industrial-Grade Standard
[ HARDER IMAGE ]
① 3µm connector cross-section close-up ② DDR4 keying notch detail ③ 7×24 stability visual ④ Lifetime warranty badge
[ SOLID — MAIN ] Heatspreader full shot NX1 Front View White geometry callout
[ High-stakes execution curve ] NX1 flat white line vs competitor drifting grey
[ Oscilloscope signal simulation ] 1.35V clean waveform vs noisy competitor
02 — Solid
Solid
Shadow Edge Armor · Zero Throttle · 1.35V High-Yield Signal
Speed means nothing if it can't hold.
The NX1 is built to run at rated speed, not just hit it once and back off.
You'll need a coffee break. The NX1 won't. 你需要休息一下。NX1 不用。
Matte Black Aluminum Heatspreader · Shadow Edge Geometry — Heavy-duty aluminum armor engineered for sustained thermal dissipation. It doesn't just cool — it prevents heat saturation from degrading your memory ICs during back-to-back rendering sessions or extended competitive gaming.
▸ Visual: 極端熱壓力動畫 — 紅色熱量從記憶體 IC 快速擴散，撞上啞光黑色鎧甲後被擊散
Stable operation under prolonged load — Zero frequency drift. Zero signal degradation. Built to maintain a flat performance line under sustained, high-load conditions — ensuring your 100th hour of execution is just as flawless as your first.
▸ Visual: 高壓執行曲線圖 — NX1 維持不動搖的白色平直線，競品頻率線在灰色中下墜抖動
1.35V High-Yield Signal — Factory-binned high-grade ICs, selected for XMP performance. Operating at 1.35V delivers the signal voltage margin needed to sustain tight XMP timings cleanly — without thermal degradation compromising your long-run stability.
▸ Visual: 示波器數據模擬 — 訊號波形在 1.35V 下收斂為銳利穩定的波形，對比雜訊下不規則的競品波形
Broad Platform Compatibility — Fully compatible with both Intel and AMD DDR4 platforms. Please note XMP 2.0 overclocking is an Intel specification; AMD platforms will run at default JEDEC standard speeds.
▸ Visual: Highlight Intel XMP 2.0 activation; secondary note for AMD default JEDEC speed.
1.35V
XMP Sweet Spot
vs DDR4 JEDEC 1.2V
100%
Burn-In Tested
Every module. Before it ships.
Frequency
Hour 1
Hour 100
Stable
03 — Faster
Faster
3200 / 3600MT/s · XMP One-Click OC
6.4
DDR2 GB/s
12.8
DDR3 GB/s
28.8
NX1 XMP GB/s
Up to 3600MT/s with XMP — one BIOS switch to unlock full rated speed. No manual timing tables. No guesswork.
Up to 28.8 GB/s with XMP — faster game load times. Snappier app response. Less waiting between tasks.
Dual-channel Kit matched pair — two NX1 modules running in tandem doubles effective bandwidth. The system doesn't just run faster — it thinks faster.
Intel XMP 2.0 Ready — Rated speed at one click. Tested and validated at XMP 2.0 frequencies before leaving the factory. DDR4 XMP is an Intel specification — AMD DDR4 platforms run at JEDEC standard speeds.
▸ Visual: Intel XMP 2.0 badge + BIOS OC screen reference
Dual-channel Kit optimized — Available as matched 8GB×2 / 16GB×2 kits. Same batch, same timing, same voltage. Designed to run together from day one.
▸ Visual: Kit dual-stick + dual-channel bandwidth comparison
Stringent multi-stage QC testing — Every module stress-tested at rated XMP speed before shipping. Stability isn't promised — it's proven on the test bench.
▸ Visual: QC flow — chip selection → timing validation → XMP stability test → ship
No weak points across all key metrics — Speed · Thermal · Stability · Compatibility · Durability. A full-spectrum performer that never asks for special conditions.
▸ Visual: 5-axis radar — NX1 full, DDR3 small & dim · Axes: Speed / Thermal / Stability / Compat. / Durability
XMP
One-Click OC
2×
Dual-Channel Kit
[ Intel XMP 2.0 badge ]
Packaging Design
Simorchip
NX1
Heatsink Series · DDR4
16GBDDR4 3200MT/s
NX1DDR4 · 16GB
CERoHSFCCREACH
Packaging Design
📦
Product Information Window
The module sticker is visible on the packaging. Model number, serial number, certifications — everything confirmed before the box is opened.
◼
Shadow Edge Design Language
Black and white geometric identity on both module and box. Consistent from shelf to slot.
🔢
Single & Kit Options
Available as single modules (8GB / 16GB / 32GB) or matched dual-channel kits. Kit pairs are from the same production batch for guaranteed compatibility.
✅
Global Certifications
RoHS · REACH · CE · FCC — certified for EU, US, and Asia-Pacific markets.
🛡️
Lifetime Warranty Included
Every NX1 ships with Simorchip's Limited Lifetime Warranty. Our confidence in this product doesn't expire.
Specifications
Engineered for optimum speed, endurance, reliability, and multi-platform compatibility.
Speed
3200 / 3600 MT/s
Capacity
8GB / 16GB / 32GB
CAS Latency
CL16 / CL18
Voltage
1.35V
Pin Count
288 pin (3µm Hard Gold)
Module Type
DDR4 U-DIMM
Dimensions
133.35 × 31.25 × 8.5 mm
Operating Temp
0°C ~ 85°C (32°F ~ 176°F)
Platform
Intel XMP 2.0 Ready — Enable with one click in the BIOS on Intel platforms to unlock full rated speed. AMD DDR4 platforms will run at default JEDEC standard speeds.
Certifications
RoHS / REACH / CE / FCC
Warranty
Limited Lifetime Warranty
* All data secured from Simorchip's internal labs under specific testing conditions. Accurate data may vary depending on the operating environment.
Product Configuration — DDR4-3200 U-DIMM
Capacity
Component
Rank
Model Name
8GB
(1Gx8)×8C
1Rx8
CR3200XNX1-8G (XMP)
16GB
(1Gx8)×16C
2Rx8
CR3200XNX1-16G (XMP)
32GB
(2Gx8)×16C
2Rx8
CR3200XNX1-32G (XMP)
Product Configuration — DDR4-3600 U-DIMM
Capacity
Component
Rank
Model Name
8GB
(1Gx8)×8C
1Rx8
CR3600XNX1-8G (XMP)
16GB
(1Gx8)×16C
2Rx8
CR3600XNX1-16G (XMP)
32GB
(2Gx8)×16C
2Rx8
CR3600XNX1-32G (XMP)
* The "(XMP)" suffix in the model name indicates that the profile is verified for Intel XMP 2.0. On AMD platforms, the system will boot at default JEDEC speeds.